Allocation & Obsolescence

For 30 years Winslow has been at the forefront of mitigating obsolescence through the remanufacture of legacy components which makes us your trusted source for fast, cost effective solutions to obsolescence and supply chain shortages. Adapt from a single or multiple components to any footprint, reverse engineering of plastic & metal parts where drawings no longer exist and diminished connector types.

Package/Footprint Conversion

Suitable for prototyping, bridging a supply gap or solving obsolescence these adapters/interposers enable the use of another component, perhaps from the same family, that has a different footprint whether the pin configuration is the same or not.

Component shortages are not just about increased demand, a number of other factors such as production capacity, supply chain disruptions, technology migration and mergers & acquisitions contribute to product scarcity and decline.

Clients of Winslow adopt a pragmatic approach, using our Adaptic programme to identify a direct alternative capable of mounting to your target board until supply of the original components stabilises. Taking this route offers a speedy, cost effective option that won’t jeopardise traceability, production targets will still be met and management pressure minimised.

Many standard package types are already designed and available for fast turnaround with some available for next day delivery from NACsemi's Store.

Winslow Adaptics proprietary interconnect techniques for package conversion have been successfully tested to MIL-STD 202 method 213 using MIL-STD 810 method 516.6 and MIL-STD 202 method 204 using MIL-STD 810 method 514.6 for Shock and Vibration.

PLCC Pads To DIL

PLCC Pads To PGA

QFP To PGA w/Socket

QFP To PGA

SOP To DIP

QFN To DIP

PLCC Socket To DIL

PLCC Socket To PGA

QFP & TQFP To PGA

DIP To PLCC

PGA To PLCC

DIP Reducer

DIP To SOIC/SOJ

Device Re-Targeting

Winslow solutions harness our extensive knowledge of electronic hardware & software design and interconnect to reconfigure this intelligent core. Our drop-in alternatives bring the latest component technology to your board without the requirement for re-design or full system test.

Our experienced engineers will carry out electronic circuit analysis, select appropriate programmable device, produce the hardware design to match with the I/O standards and voltages of the target board and create appropriate schematic and/or VHDL software to emulate the original device with final test up to full functional capability. RTCA/DO-254, Design Assurance Guidance for Airborne Electronic Hardware is adopted when required.

Our capacity to re-target an ASIC into an FPGA and marry the FPGA to the ASIC footprint is cost effective and provides an opportunity to consider function expansion and a system upgrade. We don’t only fix the ASIC problem though, whatever the component tripping you up - Active or Passive – Winslow can propose a solution.

Reverse Engineering

Our reverse engineering service extends to reviewing hard copy drawings for material and treatment processes in line with the EU REACH regulations, scanning complex forms to an accuracy of 5 microns where drawings no longer exist and manufacturing a minimum order quantity of just one part using CNC Machining, 3D Printing, Plastic Moulding or Casting.

Connector Solutions

Winslow continue to maintain tooling for legacy connectors and will cross refer to most manufacturers part number and/or drawings.