Wieland offers high performance & scalable standard cold plates. These standard liquid-cooled power module and CPU cold plates are designed to fit most of the industry standard power module configurations on the market for both IGBT & SiC MOSFET technology. The 3000 Series uses Wieland’s patented Micro Deformation Technology (MDTTM) in line pin fin, friction stir welded construction, and CFD optimized parallel cooling.
Wieland’s 3000 series standard cold plates come in both Standard and XP varieties. These standard cold plates have 12 fins per inch, or the XP standard cold plates deliver extreme performance with 20 fins per inch.
All Cold Plates are manufactured & tested to:
Product Name | Module Size | Module Name | Module Name | Module Name | Module Name | Size (mm) |
---|---|---|---|---|---|---|
CP 3001 | 3X 122x62 | Infineon EconoDUAL | Semikron SEMIX | PowerEx NX | 160x227 | |
CP 3002 | 1x122x162 | Infineon EconoPACK | Semikron SEMIX33 | PowerEx Intellimod | Fuji M629 | 160x198 |
CP 3003 | 1X SKIM 93 | Semikron SKIM93 | 205x198 | |||
CP 3004 | 1X SKIM 63 | Semikron SKIM63 | 205x198 | |||
CP 3005 | 3X Prime PACK 3 | Infineon PrimePACK3 | Fuji M272 | 305x308 | ||
CP 3006 | 3X Mega Dual | PowerEx Mega Power Dual | Mega Dual | 205x511.5 | ||
CP 3007 | 1X 140x190 | ABB HiPAK | Fuji M152/156 | 160x225 | ||
CP 3008 | 1X 140x130 | ABB HiPAK | Fuji M256/M278 | 160x168 | ||
CP 3009 | 3X 62x108 | Infineon 62mm | Semikron SEMITRANS | Fuji M127/M234/M235 | MicroSemi SP6/D3/D4 | 130x225 |
CP 3010 | 3X Prime PACK 2 | Infineon PrimePACK2 | Fuji M271 | 305x308 | ||
CP 3012 | 3X XM3 53x80mm | Wolfspeed CAB450M12XM3 | Wolfspeed CAB400M12XM3 | 100 x 195 |