Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512K-bit to 512M-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than four times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash® devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for space constrained mobile and handheld applications.
Winbond Series | Density | Voltage | Speed | Temp# | Features | Packages | DataSheet |
---|---|---|---|---|---|---|---|
Winbond Series | Density | Voltage | Speed | Temp# | Features | Packages | DataSheet |
W25M512JV | 512Mb | 2.7V - 3.6V | 104MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI / QPI Simultaneous Operation | SOIC16300mil,WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) | |
W25M512JW | 512Mb | 1.7V - 1.95V | 104MHz | -40℃ ~ 85℃ | SPI / QPI Simultaneous Operation | SOIC16300mil,WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) | |
W25Q01JV | 1Gb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ | SPI / QPI | SOIC16300mil,TFBGA24 6X8mm (5x5 Matrix) | |
W25Q10EW | 1Mb | 1.65V - 1.95V | 104MHz | -40℃ ~ 85℃ / -40℃ ~ 125℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,WLCSP8, VSOP8 150mil, USON8 2X3mm | |
W25Q128FV | 128Mb | 2.7V - 3.6V | 104MHz | -40℃ ~ 85℃ | SPI / QPI | SOIC8 208mil,SOIC16300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil | |
W25Q128JV | 128Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm (6x4 Ball Array), 8-pad WSON 6x5-mm, 8-pad WSON 8x6-mm, 24-ball TFBGA 8x6-mm (5x5 Ball Array) | |
W25Q128JW | 128Mb | 1.7V - 1.95V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | SOIC8 208mil,SOIC16300mil,WSON 6X5mm | |
W25Q16JL | 16Mb | 2.3V - 3.6V | 50/104MHz | -40℃ ~ 85℃ | SPI 4 I/O Fixed | SOIC8 150mil,SOIC8 208mil, WSON 6X5mm,VSOP8 150mil, USON 2x3mm | |
W25Q16JV | 16Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | 8-pin SOIC 150-mil, 8-pin SOIC 208-mil, 8-pad USON 4x3-mm, 8-pad USON 2x3mm, 8-pad XSON 4x4-mm, 8-pad WSON 6x5-mm, 8-ball WLCSP | |
W25Q16JW | 16Mb | 1.65V - 1.95V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | 8-pin SOIC 150-mil, 8-pin SOIC 208-mil, 8-pad USON 4x3-mm, 8-pad USON 2x3mm, 8-pad XSON 4x4-mm, 8-pad WSON 6x5-mm, 8-ball WLCSP | |
W25Q20CL | 2Mb | 2.3V - 3.6V | 80/104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3mm | |
W25Q20EW | 2Mb | 1.65V - 1.95V | 104MHz | -40℃ ~ 85℃ / -40℃ ~ 125℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,WLCSP8, VSOP8 150mil, USON8 4X3mm, USON8 2X3mm | |
W25M512JV | 256Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed 4 I/O Fixed | 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm (6x4 Ball Array), 8-pad WSON 8x6-mm, 24-ball TFBGA 8x6-mm (5x5 Ball Array) | |
W25M512JW | 256Mb | 1.7V - 1.95V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | SOIC16300mil,WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), WLBGA32 | |
W25M512JW | 256Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ | 4-Byte Addressing Mode 4 I/O Fixed | SOIC16300mil,WSON8 8X6mm, | |
W25Q128JV | 32Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | 8-pin SOIC 208mil, 16-pin SOIC 300mil, 24-ball TFBGA 8x6-mm (6x4 Ball Array), 24-ball TFBGA 8x6-mm (5x5 Ball Array), 8-pin VSOP 208mil, 8-pin PDIP 300-mil, 8-pad WSON 6x5mm, 8-pad WSON 8x6mm, 8-pad XSON 4x4x0.45mm | |
W25Q128JW | 32Mb | 1.7V - 1.95V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | 8-pin SOIC 208mil, 16-pin SOIC 300mil, 24-ball TFBGA 8x6-mm (6x4 Ball Array), 24-ball TFBGA 8x6-mm (5x5 Ball Array), 8-pin VSOP 208mil, 8-pin PDIP 300-mil, 8-pad WSON 6x5mm, 8-pad WSON 8x6mm, 8-pad XSON 4x4x0.45mm | |
W25Q128JW | 4Mb | 2.3V - 3.6V | 80/104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil, SOP8 150mil, SOIC8 208mil,USON8 2X3mm, WLCSP8 | |
W25Q128JW | 4Mb | 1.65V - 1.95V | 104MHz | -40℃ ~ 85℃ / -40℃ ~ 125℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,SOP8 208mil, VSOP8 150mil, WSON 6X5mm, WLCSP8 | |
W25Q128JW | 512Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ | SPI 4 I/O Fixed | SOIC16300mil,WSON8 8X6mm,TFBGA24 6X8mm (5x5 Matrix) | |
W25Q16JL | 64Mb | 2.7V - 3.6V | 104MHz | -40℃ ~ 85℃ | SPI / QPI | SOIC8 208mil,SOIC16300mil, WSON6X5mm,WSON8 8X6mm, PDIP8 300mil, VSOP 208mil TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil | |
W25Q16JV | 64Mb | 1.65V - 1.95V | 104MHz | -40℃ ~ 85℃ | SPI / QPI | SOIC8 208mil, WSON6X5mm, VSOP8 208mil, WLCSP8, WLBGA16 | |
W25Q16JW | 64Mb | 2.7V - 3.6V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | SOIC8 208mil, SOIC16 300mil, WSON6X5mm, WSON8 8X6mm, XSON8 4x4x0.45mm, TFBGA24 6X8mm (4x6 Ball Array). 24-ball TFBGA 8x6-mm (5x5 Ball Array) | |
W25Q256JV | 64Mb | 1.7V - 1.95V | 133MHz | -40℃ ~ 85℃ / -40℃ ~ 105℃ | SPI 4 I/O Fixed | SOIC8 208mil,WSON6X5mm, XSON8 4x4x0.45mm, TFBGA24 6X8mm (4x6 Ball Array). 24-ball TFBGA 8x6-mm (5x5 Ball Array), WLCSP | |
W25Q256JV | 8Mb | 2.3V - 3.6V | 104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,VSOP 150mil, WSON 6X5mm, USON8 2X3mm, WLCSP8, WLCSP8 | |
W25Q256JW | 8Mb | 2.7V - 3.6V | 80MHz | -40℃ ~ 85℃ / -40℃ ~ 125℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,SOIC8 208mil,WSON 6X5mm,USON8 2X3mm | |
W25Q80EW | 8Mb | 1.65V - 1.95V | 104MHz | -40℃ ~ 85℃ / -40℃ ~ 125℃ | SPI with Single, Dual, Quad I/O | SOIC8 150mil,SCIC8 208mil, WSON 6X5mm, VSOP8 150mil, USON8 2X3, WLCSP8 | |
W25X05CL | 512Kb | 2.3V - 3.6V | 104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O RPMC | SOIC8 150mil, USON 2x3mm | |
W25X10CL | 1Mb | 2.3V - 3.6V | 80/104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O RPMC | SOIC8150mil,USON8 2X3mm, | |
W25X20CL | 2Mb | 2.3V - 3.6V | 80/104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O RPMC | SOIC8 150mil, VSOP8 150mil,USON8 2X3mm, WLCSP | |
W25X40CL | 4Mb | 2.3V - 3.6V | 80/104MHz | -40℃ ~ 85℃ | SPI with Single, Dual, Quad I/O RPMC | SOIC8 150mil,VSOP8 150mil, USON 2X3mm,WSON 6X5mm, SOIC8 208mil, WLCSP8 |