SpiStack Flash

Winbond is the first company to offer the new SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements. SpiStack® architecture offers designers maximum flexibility in tailoring flash solutions to meet their specific memory-density and application requirements. The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. W25M memories also feature the popular, multi-IO SpiFlash® interface featuring the popular Serial Peripheral Interface (SPI) and command set SpiStack® homogeneous memories are formed by stacking SpiFlash dies – for example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. This stacked product, W25M512JV, is also available now in 16-pin SOIC or 24-pad BGA packages. SpiStack® heterogeneous memories are formed by stacking a NOR die with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory.